Based on the customer's chip design architecture and power indicators, it provides new thermally conductive and insulating packaging materials and processes at different levels of its chip packaging (level 0-3), so as to realize the precise application and customization mode of international leading high-end chip packaging materials and solutions. Under the high junction temperature and high power working conditions for the customer’s chip integration system, realize a package heat dissipation solution with ultra-uniform thermal conductivity, light weight, easy processability and high product design freedom, and continuously improve the voltage breakdown of the package material Strength, while constantly refreshing the lower thermal resistance coefficient of the packaging system.